Dallas, Texas (PRWEB) July 30, 2013
The report provides a deep dive into each of the patent portfolios including SEMCO, ASE, Samsung, Unimicron, Intel, Imbera, Shinko, Murata, LG Innotek and Daeduck. For each of these companies, the report provides an in-depth analysis of the patent portfolio, highlighting the following points: company profile, company patent portfolio evolution, countries of deposition and origin of the patents, top inventors, technical segmentation of each patent portfolio, patent portfolio analysis for each manufacturing process step and architecture and main technical innovations. This analysis by company provides an in-depth view of the strengths and weaknesses of each patent portfolio and of the developments now implemented by each company.
Companies listed in the report “Embedded Die in Package Patent Investigation” (http://www.reportsnreports.com/reports/266701-embedded-die-in-package-patent-investigation.html):
Amkor, Analog Devices, ASE, AT&S, Casio, Ciretec, CMK, Continental, CSR, Daeduck, Denso, Dialog Semi, Dyconnex, Epcos, Fairchild, Flip Chip International, Fraunhofer IZM, Fujitsu, Hermes, Ibiden, Imbera, IMEC, Intel, Ipdia, LG, Maxim, Microchip, Murata, National Semiconductor, NEC, Nepes, nVidia, NXP, OKI, On Semi, Panasonic, Qualcomm, Rambus, Renesas, Samsung, SEMCO, Schweizer, Shinko, Sony, SPIL, STATS ChipPAC, STEricsson, STMicroelectronics, TDK, Taiyo Yuden, Texas Instruments, Toshiba, Unimicron, UTAC and VTI (Murata).
Patents in the embedded domain are mainly filed by firms or universities located in Korea (33%), Japan (21%) and USA (19%). Japanese and American players were the early adopters of the technology and they are still deeply involved in this business. Korea emerged as new key player in 2005.
The report includes 10 companies among the most active players identified in this complete statistical analysis to lead an accurate description of their patent portfolios. It provides a database of all the relevant patents analyzed in an Excel file, which allows multi-criteria searches. The criteria are basically those we used for the technological segmentation:
Patent information: Patent publication number, link to the PDF, document, oldest priority date, title, assignee, patent potential ranking, nb of citing patent families and Technological segmentation: chip placement / bonding, tape lamination, RDL, passivation & balling.
Request a Sample of this report @ http://www.reportsnreports.com/contacts/RequestSample.aspx?name=266701.
An Exhaustive Comparison between Patent and Existing Products
The report also includes a comparison between the 2 identified existing products using Embedded IC technology, currently used for DCDC converter packaging: TI MicroSiP packaged by AT&S and Rohm device packaged by EPCOS TDK.
For each of these two packages, an exhaustive comparison is provided between the real process flow (recreated by reverse engineering during a teardown) and the identified patents. The process enables an overview of the real material, process techniques and architectures that are in production today.
Complete report available for purchase @ http://www.reportsnreports.com/Purchase.aspx?name=266701.
Objectives of the Report
Overview of “who is owning what” in terms of patents for the embedded IC in Package technologies, plus a dedicated focus on 10 players we consider as the most active in this area
Key Features of the Report
Statistical analysis of existing IP to give a landscape overview and understand:
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