Dallas, Texas (PRWEB) July 30, 2013
The report provides a deep dive into each of the patent portfolios including SEMCO, ASE, Samsung, Unimicron, Intel, Imbera, Shinko, Murata, LG Innotek and Daeduck. For each of these companies, the report provides an in-depth analysis of the patent portfolio, highlighting the following points: company profile, company patent portfolio evolution, countries of deposition and origin of the patents, top inventors, technical segmentation of each patent portfolio, patent portfolio analysis for each manufacturing process step and architecture and main technical innovations. This analysis by company provides an in-depth view of the strengths and weaknesses of each patent portfolio and of the developments now implemented by each company.
Companies listed in the report “Embedded Die in Package Patent Investigation” (http://www.reportsnreports.com/reports/266701-embedded-die-in-package-patent-investigation.html):
Amkor, Analog Devices, ASE, AT&S, Casio, Ciretec, CMK, Continental, CSR, Daeduck, Denso, Dialog Semi, Dyconnex, Epcos, Fairchild, Flip Chip International, Fraunhofer IZM, Fujitsu, Hermes, Ibiden, Imbera, IMEC, Intel, Ipdia, LG, Maxim, Microchip, Murata, National Semiconductor, NEC, Nepes, nVidia, NXP, OKI, On Semi, Panasonic, Qualcomm, Rambus, Renesas, Samsung, SEMCO, Schweizer, Shinko, Sony, SPIL, STATS ChipPAC, STEricsson, STMicroelectronics, TDK, Taiyo Yuden, Texas Instruments, Toshiba, Unimicron, UTAC and VTI (Murata).
Patents in the embedded domain are mainly filed by firms or universities located in Korea (33%), Japan (21%) and USA (19%). Japanese and American players were the early adopters of the technology and they are still deeply involved in this business. Korea emerged as new key player in 2005.
The report includ
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