Navigation Links
UT Arlington engineers working to prevent heat buildup within 3D integrated circuits
Date:12/19/2012

In the effort to pile more power atop silicon chips, engineers have developed the equivalent of mini-skyscrapers in three-dimensional integrated circuits and encountered a new challenge: how to manage the heat created within the tiny devices.

But a team of UT Arlington researchers funded by the National Science Foundation is working first to minimize the heat generated and then to developing nano-windows that will allow the heat to dissipate before it damages the chip.

Ankur Jain, assistant professor of mechanical and aerospace engineering, is working with colleague Dereje Agonafer, professor of mechanical and aerospace engineering, and Roger Schmidt, IBM fellow and chief engineer, on the project.

"There is only a very limited amount of space available on an integrated circuit so we've had to build vertically, placing wafers on top of wafers," Jain said. "These 3D integrated circuits have led to significant performance improvements. However, when we stack these circuits on top of each other, heat starts to become a problem."

He added: "All the heat being generated in this multi-layer stack needs to be removed, otherwise it causes deterioration in performance."

Agonafer said the team will investigate and measure fundamental thermal transport and thermomechanical properties of materials and interfaces in 3D integrated circuit technology.

The team also will look at Through-Silicon Vias, or TSVs high-performance wires that allow integrated circuits to talk to each other and pass instructions from one level to the next.

Jain and Agonafer believe the cooling effects will boost the efficiency and speed of the 3D integrated circuits as well.

Schmidt said UT Arlington is one of the many academic partners IBM works with to find solutions for tomorrow's computing needs.

"Cooling chips has come a long way in recent years, but the financial savings can be enormous," Schmidt said. "Reducing heat just a little can translate to millions of dollars in savings down the road. Plus, typically solving the heat problem also yields faster, more reliable and more powerful computing."

Jean-Pierre Bardet, dean of the UT Arlington College of Engineering, said the project demonstrates the important role that a research institution can play in partnering with industry leaders, such as IBM.

"Their work will help not only chip manufacturers but any business whose products depend on 3D, integrated circuit technology," Bardet said. "We are pleased to be partnering with a worldwide innovator in research that will improve technology we have all come to depend upon."


'/>"/>

Contact: Herb Booth
hbooth@uta.edu
817-272-7075
University of Texas at Arlington
Source:Eurekalert

Related biology technology :

1. UT Arlington research team wins $1.35 million NSF robotics grant to develop smart skin applications
2. UCLA engineers develop new energy-efficient computer memory using magnetic materials
3. Engineers achieve longstanding goal of stable nanocrystalline metals
4. Stanford engineers perfecting carbon nanotubes for highly energy-efficient computing
5. Cloak of invisibility: Engineers use plasmonics to create an invisible photodetector
6. Straintronics: Engineers create piezoelectric graphene
7. Stanford engineers weld nanowires with light
8. Arizona State University engineers aim to improve performance of technology in extreme environments
9. Stanford engineers use nanophotonics to reshape on-chip computer data transmission
10. "Just Label It" condemns dangerous riders snuck into the Farm Bill by chemical companies working to keep Americans in the dark about their food
11. Pittcon 2013 Announces Call for Topics for Conferee Networking Sessions, August 1, 2012 Deadline
Post Your Comments:
*Name:
*Comment:
*Email:
(Date:5/25/2016)... ... May 25, 2016 , ... Thailand’s Board of Investment’s ... in San Francisco. Located at booth number 7301, representatives from the Thai Government, ... discuss the Thai biotechnology and life sciences sector. , Deputy Secretary General ...
(Date:5/25/2016)... , ... May 25, 2016 , ... WEDI, the nation’s ... exchange, today announced that Charles W. Stellar has been named by the WEDI Board ... since January 2016. As an executive leader with more than 35 years of experience ...
(Date:5/24/2016)... ... May 24, 2016 , ... Last week, Callan Capital, an ... and entrepreneurs, held The Future of San Diego Life Science event at the Estancia ... science community attended the event with speakers Dr. Rich Heyman, former CEO of Aragon ...
(Date:5/23/2016)... England , May 23, 2016 ... May 25 th at 10:15 a.m. ET before the ... the role genetically engineered mosquitos can play in controlling the ... carrier of the Zika virus.      (Logo: ... engineered male mosquito with a self-limiting gene. Trials in ...
Breaking Biology Technology:
(Date:5/24/2016)... IRVINE, Calif. , May 24, 2016 Ampronix facilitates superior patient care ... LMD3251MT  3D medical LCD display is the latest premium product recently added to ... ... ... Sony 3d Imaging- LCD Medical Display- Ampronix News ...
(Date:5/20/2016)... -- VoiceIt is excited to announce its new marketing ... working together, VoiceIt and VoicePass will offer an ... slightly different approaches to voice biometrics, collaboration between ... Both companies ... "This marketing and technology partnership allows VoiceIt ...
(Date:5/16/2016)... NEW YORK , May 16, 2016   ... authentication solutions, today announced the opening of an IoT ... to strengthen and expand the development of embedded ... provides an unprecedented level of convenience and security with ... to authenticate one,s identity aside from DNA. EyeLock,s platform ...
Breaking Biology News(10 mins):