Navigation Links
UT Arlington engineers working to prevent heat buildup within 3D integrated circuits
Date:12/19/2012

In the effort to pile more power atop silicon chips, engineers have developed the equivalent of mini-skyscrapers in three-dimensional integrated circuits and encountered a new challenge: how to manage the heat created within the tiny devices.

But a team of UT Arlington researchers funded by the National Science Foundation is working first to minimize the heat generated and then to developing nano-windows that will allow the heat to dissipate before it damages the chip.

Ankur Jain, assistant professor of mechanical and aerospace engineering, is working with colleague Dereje Agonafer, professor of mechanical and aerospace engineering, and Roger Schmidt, IBM fellow and chief engineer, on the project.

"There is only a very limited amount of space available on an integrated circuit so we've had to build vertically, placing wafers on top of wafers," Jain said. "These 3D integrated circuits have led to significant performance improvements. However, when we stack these circuits on top of each other, heat starts to become a problem."

He added: "All the heat being generated in this multi-layer stack needs to be removed, otherwise it causes deterioration in performance."

Agonafer said the team will investigate and measure fundamental thermal transport and thermomechanical properties of materials and interfaces in 3D integrated circuit technology.

The team also will look at Through-Silicon Vias, or TSVs high-performance wires that allow integrated circuits to talk to each other and pass instructions from one level to the next.

Jain and Agonafer believe the cooling effects will boost the efficiency and speed of the 3D integrated circuits as well.

Schmidt said UT Arlington is one of the many academic partners IBM works with to find solutions for tomorrow's computing needs.

"Cooling chips has come a long way in recent years, but the financial savings can be enormous," Schmidt said. "Reducing heat just a little can translate to millions of dollars in savings down the road. Plus, typically solving the heat problem also yields faster, more reliable and more powerful computing."

Jean-Pierre Bardet, dean of the UT Arlington College of Engineering, said the project demonstrates the important role that a research institution can play in partnering with industry leaders, such as IBM.

"Their work will help not only chip manufacturers but any business whose products depend on 3D, integrated circuit technology," Bardet said. "We are pleased to be partnering with a worldwide innovator in research that will improve technology we have all come to depend upon."


'/>"/>

Contact: Herb Booth
hbooth@uta.edu
817-272-7075
University of Texas at Arlington
Source:Eurekalert

Related biology technology :

1. UT Arlington research team wins $1.35 million NSF robotics grant to develop smart skin applications
2. UCLA engineers develop new energy-efficient computer memory using magnetic materials
3. Engineers achieve longstanding goal of stable nanocrystalline metals
4. Stanford engineers perfecting carbon nanotubes for highly energy-efficient computing
5. Cloak of invisibility: Engineers use plasmonics to create an invisible photodetector
6. Straintronics: Engineers create piezoelectric graphene
7. Stanford engineers weld nanowires with light
8. Arizona State University engineers aim to improve performance of technology in extreme environments
9. Stanford engineers use nanophotonics to reshape on-chip computer data transmission
10. "Just Label It" condemns dangerous riders snuck into the Farm Bill by chemical companies working to keep Americans in the dark about their food
11. Pittcon 2013 Announces Call for Topics for Conferee Networking Sessions, August 1, 2012 Deadline
Post Your Comments:
*Name:
*Comment:
*Email:
(Date:2/5/2016)... 5, 2016 On Thursday, February 11, ... for community, health and disaster services, and the ... to enhance care coordination and service delivery for the ... need and to better connect service providers to the ... San Diego has handled more than ...
(Date:2/5/2016)... , Feb. 5, 2016 Australian-US drug discovery and ... today the appointment of a new Chairman, Mr John ... , effective immediately. James Garner , has ... Director and former Acting CEO, Mr Iain Ross , ... Director. --> James Garner , has also been ...
(Date:2/4/2016)... -- - New FDA action date of July ... date of July 22, 2016   --> ... 2016   - Lifitegrast has the potential ... the treatment of signs and symptoms of dry eye disease in ... be the only product approved in the U.S. in the past decade indicated for the ...
(Date:2/4/2016)... ... February 04, 2016 , ... Shimadzu ... quad LC-MS, host live demos and poster sessions, and present on the analysis ... conference takes place March 6 to 10 at the Georgia World Congress Center ...
Breaking Biology Technology:
(Date:2/1/2016)... Fla. , Feb. 1, 2016  Wocket® smart wallet ( www.wocketwallet.com ... and television personality, Joey Fatone . Las Vegas ... greet fans. --> Las Vegas , where ... --> The new video ad was filmed at the Consumer ... appeared at the Wocket booth to meet and greet fans. ...
(Date:1/27/2016)... 2016  Rite Track, Inc. a leading semiconductor equipment ... Chester, Ohio announced today the acquisition of PLUS ... in Austin, Texas , will significantly ... modifications, installations and technical support offerings for TEL Track ... commented, "PLUS has provided world class service including refurbishment, ...
(Date:1/25/2016)... , Jan. 25, 2016  Glencoe Software, the ... pharma and publication industries, will provide the data management ... Centre (NPSC). ... Phenotypic analysis measures ... whole organisms, allowing comparisons between states such as health ...
Breaking Biology News(10 mins):