BUFFALO, N.Y. -- In the quest to pack ever-smaller electronic devices more densely with integrated circuits, nanotechnology researchers keep running up against some unpleasant truths: higher current density induces electromigration and thermomigration, phenomena that damage metal conductors and produce heat, which leads to premature failure of devices.
But University at Buffalo researchers who study electronics packaging recently made a pleasant discovery: that's not the case with Single-Walled Carbon Nanotubes (SWCNTs).
"Years ago, everyone thought that the problem of cooling for electronics could be solved," said Cemal Basaran, Ph.D., professor in the UB Department of Civil, Structural and Environmental Engineering and director of the Electronics Packaging Lab in UB's School of Engineering and Applied Sciences. "Now we know that's not true. Electronics based on metals have hit a wall. We are done with metals."
Single Walled Carbon Nanotubes are extremely thin, hollow cylinders, measuring no thicker than a single atom. Thousands of times stronger than metals, they are expected to one day replace metals in millions of electronic applications.
Basaran and his doctoral student Tarek Ragab have spent the past four years performing quantum mechanics calculations, which prove that in carbon nanotubes, higher current density does not lead to electromigration and thermomigration; it also produces just one percent of the heat produced by traditional metals, such as copper.
Basaran will present the findings in November when he delivers a keynote lecture at the American Society of Mechanical Engineers (ASME) International Mechanical Engineering Congress and Exposition in Orlando.
The findings demonstrate yet another tantalizing property of CNTs, he said.
"It has been assumed that for carbon nanotubes, the electrical heating process would be governed by Joules law, where resistance in a circuit converts electric energy into heat," sa
|Contact: Ellen Goldbaum|
University at Buffalo