KINSTON, N.C., Aug. 3, 2011 /PRNewswire/ -- Spatial Integrated Systems, Inc. ("SIS"), a leader in the development and integration of solutions incorporating next generation digital 3D data capture and processing technologies, announced today that it has been awarded U.S. patent 7,986,321 for a system and method for generating structured light for three-dimensional image rendering.
"We are pleased that our technical efforts have resulted in the award of another patent, reflecting the ingenuity of our design team," said Dr. Ali Farsaie, President and CEO of SIS. "This latest technology [3D SNAPSHOT] represents a significant leap forward in the area of three-dimensional imaging and rendering using cost-effective equipment," said Farsaie.
SIS plans to use this new technology for applications including biometrics, robotics navigation, reverse engineering and design prototyping. "This technology will improve homeland security and commercial applications," said Greg Walker, Director of Marketing. "End-users of three-dimensional imaging will benefit strongly from the vast improvements in data quality that SIS's 3D SNAPSHOT offers."
About SIS: With offices in NC, MD, VA, WV, and WA, and with federal and commercial customers throughout the US, SIS offers an integrated set of products and services supporting reverse engineering, design, prototyping, manufacturing integration, and IT. SIS provides high-end business solutions that incorporate Digital 3D Imaging, Robotics, Artificial Intelligence, and 3D Visualization technologies. SIS's process-based solutions are targeted at transitioning traditional manual and/or paper-based paradigms to an all-digital environment that enables users to realize significant cost savings, resource optimization, and efficiency improvements of an integrated data environment. For more information, visit http://www.sisinc.org.
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|SOURCE Spatial Integrated Systems, Inc.|
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