Troy, N.Y. Rensselaer Polytechnic Institute Professor James Jian-Qiang Lu was recognized recently for his innovative research and technical achievements toward the design and realization of 3-D integrated computer chips.
Lu, associate professor in the Department of Electrical, Computer, and Systems Engineering (ECSE) at Rensselaer, last week received the prestigious William D. Ashman Achievement Award for 2010 from the International Microelectronics and Packaging Society (IMAPS). As part of the award, Lu was elevated to a life member and fellow of IMAPS.
This award recognizes an individual who "has provided significant technical contributions to the electronics packaging industry, while participating and demonstrating support of activities to enhance the electronics packaging profession as a member," according to IMAPS. As part of the award, Lu delivered a special presentation, chaired a technical session, and moderated a panel discussion on 3-D chip integration and packaging last week at the IMAPS annual conference in Raleigh, N.C.
"We congratulate Dr. Lu on being selected for this important award, and the concurrent elevation to life member and fellow of IMAPS," said David Rosowsky, dean of the School of Engineering at Rensselaer. "This is a tremendous recognition of his accomplishments and stature in his field. His achievement shines brightly on ECSE and all of us in the School of Engineering, and we wish him continued success."
"James' research output is exceptional, but he is also an excellent teacher and an outstanding academic citizen," said Kim Boyer, head of ECSE at Rensselaer. "His work ethic and dedication have earned him the respect of the entire department. We congratulate him on this highly prestigious award."
Lu is known as a pioneer and technical leader in 3-D computer chip integration, and has been working to design the processes and architecture that could one day be the platform for 3-D chips.
Flat, conventional computer chips used today can only shrink so much smaller, as their flat surface must have enough room to accommodate scores of different components. But the semiconductor industry and academia are looking at ways to layer chip components into a vertical, 3-D stack, which could dramatically shrink the size of the overall chip and take advantage of high data bandwidth, performance efficiency, and functionality increase of the 3-D integration. Lu's research spans a wide spectrum of micro- and nanoelectronics technology, from theory and design to materials, devices, processing, and system integration.
|Contact: Michael Mullaney|
Rensselaer Polytechnic Institute