Having the ability to use one material our new PES for both photolithography and imprint will be very attractive to manufacturers, Lu said. At its core, our project is basic research, but it also has important industry implications. Its very exciting.
Manufacturers today typically use benzocyclobutene and polyimide as polymers for redistribution layers, because of their low water absorption, thermal stability, low curing temperature, low thermal expansion, low dielectric constant, and low leakage current. Lu said PES offers significant advantages to these materials, particularly in the areas of cure temperature and water uptake.
PES cures, or dries and hardens, at 165 degrees Celsius, about 35 percent cooler than the other two materials. The need for less heat should translate directly into lower overhead costs for manufacturers, Lu said. Another advantage of PES is its low water uptake rate of less than 0.2 percent, less than the other materials. Additionally, PES adheres well to copper and can easily be made less brittle if needed. All of these attributes make PES a promising candidate for redistribution layer application and UV imprint lithography.
The results demonstrate that PES is feasible to be used as UV-curable resist for both the redistribution application for electronic packaging and micro/nano imprint lithography, said Rensselaer Research Associate Pei-I Wang, co-author of the paper.
Along with photolithography and on-chip nanoimprinting lithography, PES holds the potential for applications in other optical devices, flat-panel display, biotechnology devices, and microelectromechanical systems, Wang said.
|Contact: Michael Mullaney|
Rensselaer Polytechnic Institute