The project involved all key players from the European smartcard and mobile industries: smartcard manufacturers, chipmakers, handset manufacturers, mobile operators, electronic design companies, biometrics specialists, software development/verification tool companies, security laboratories, services companies and universities.
EUREKA labelling was important because the project was industrially-led with short- to mid-term expectations. We had a strong consortium and knew there could be sharp changes in strategy dictated by the market or by the partners, so we needed flexibility, adds Tual. EUREKA provides this type of key and decisive advantage.
Advanced substrates boost chip performance
Silicon substrates are key to modern electronics components. However, as chips become ever smaller, plain silicon no longer provides the performance necessary. Development of a single platform combining the benefits of strained silicon and SOI substrate technologies in SilOnIS offers much improved performance for future chip generations, boosting the speed at which electronic messages can be transferred while reducing the energy required. Suitable wafers should be available commercially in 2008 for fabrication of devices at the 45-nm half-pitch node and below in line with global industry needs.
Close collaboration between advanced substrate manufacturers and chipmakers was essential to match the developments in the two complementary fields, says Bruno Ghyselen of project leader SOITEC.
Carrying out such a collaborative project in the framework of EUREKA brought additional
benefits; sharing the risks and the financing was a real enabler to undertake such an innovative
and high risk project. And success ensures a strategic advantage for Europe in
|Contact: Sally Horspool|