Lockheed Martin and Singapore's Nanyang Technological University (NTU) today announced a memorandum of understanding (MOU) to explore the science of nanotechnology, with special focus on nanocopper and related technologies for the commercial market.
Lockheed Martin and NTU will set up a joint research laboratory at NTU's Yunnan campus. The lab will allow NTU students and faculty to work directly with Lockheed Martin scientists on developing the nanocopper CuantumFuse technology platform, which can be used for a variety of high-tech applications.
Nanocopper is the main ingredient in a revolutionary electrical interconnect material, or solder. Known as the CuantumFuse solder, this material is expected to produce joints with up to 10 times the electrical and thermal conductivity compared to tin-based materials currently in use.
The collaboration was inked today by Professor Freddy Boey, NTU Provost and Dr. Kenneth Washington, Vice President of Lockheed Martin Space Systems Advanced Technology Center.
"This collaboration is a good example of how NTU can connect to global industrial partners to collectively develop innovative solutions to many global challenges faced today," said Professor Boey. "We hope that in the near future, scientists from both institutions will continue to explore other research topics of joint interest in areas such as satellite technology, interactive media and perhaps even deep sea mining."
The NTU-Lockheed Martin Joint Laboratory will have an initial fund of $10 million over the next four years, and will employ up to eight scientists working on collaborative research projects. It will provide a platform to allow the exchange of researchers and knowledge between the two institutions, as well as to produce various prototypes and to host prototype demonstrations.
"The collaboration we are beginning today is an enormous step forward in moving our revolutionary CuantumFuse technology out of the laboratory and into
|Contact: Lester Kok|
Nanyang Technological University