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JPSA Introduces Picosecond Laser Micromachining System

Manchester, NH (PRWEB) June 26, 2012

The JPSA picosecond laser platform, the IX-6168-PS, is designed to accept multiple types of ultrafast lasers, keeping with JPSA’s product philosophy of selecting the best available laser for the individual customer application. The laser is accommodated in a slide-out service trolley within the workstation, and is fully integrated with the system control software. Laser choices include Infra-red (IR), green or UV wavelengths, and a range of power and pulse rate options.

To maximize tool flexibility, JPSA provides a dual beam delivery configuration. For highest precision machining, a fixed-beam configuration can be used that produces a finely focused beam, and utilizes the precision air-bearing stage for precise feature positioning. Alternatively, for high-speed processing of complex shapes, a high-accuracy galvanometer configuration incorporating a step-and-scan function may be preferred. The IX-6168-PS is delivered with both fixed beam and galvanometer scanning capability, and can be easily reconfigured on site to suit individual needs.

With ultrafast laser processing, the pulse duration is shorter than the thermal diffusion timescale of the material, resulting in a direct solid to vapor transition that greatly reduces debris formation, and minimizes thermal impact on the surrounding area. This makes the technology ideal for materials that are otherwise hard to machine, and where the quality of the end result is of paramount importance.

Commenting on the new product, Jeffrey Sercel, CEO said “JPSA has been using ultrafast lasers in our Applications Development Lab and integrating them into custom-designed systems for several years. The IX-6168-PS incorporates features that can support multiple applications into one compact, efficient, standard configuration, offering higher flexibility and higher productivity in a cost-effective product.”

The IX-6168-PS can be supplied as a manual-load system, or combined with JPSA’s Integrated Automation Platform for fully automated operation in semiconductor wafer applications. Configuration options include laser wavelength, power and repetition rate, and a choice of galvanometer scanner and lens systems to optimize large deflection field applications.

JPSA products and services include UV excimer, DPSS and ultra-fast laser micromachining systems, UV and VUV laser beam delivery systems, laser materials processing development, optical damage testing, and excimer laser refurbishment services. JPSA operates a high-performance laser job shop as well as a systems engineering and manufacturing business. For more information, visit, or contact the company at 220 Hackett Hill Road, Manchester, NH, 03102 USA; Tel. 603.518.3200, Fax 603.518.3298.

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Source: PRWeb
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