Navigation Links
Cracking a tough nut for the semiconductor industry

Researchers at the National Institute of Standards and Technology (NIST) have developed a method to measure the toughnessthe resistance to fractureof the thin insulating films that play a critical role in high-performance integrated circuits. The new technique could help improve the reliability and manufacturability of ICs and, better yet, its one that state-of-the-art microelectronics manufacturers can use with equipment they already own.

At issue is the mechanical strength of so-called low-k dielectric layerselectrically insulating films only a couple of micrometers thick that are interleaved between layers of conductors and components in microprocessor chips and other high-performance semiconductor devices. As IC features like transistors have gotten ever smaller and crammed more closely together, designers are preventing electrical interference or cross-talk by making the insulating films more and more porous with nanoscale voidsbut this has made them more fragile. Brittle fracture failure of low-k insulating films remains a problem for the industry, affecting both manufacturing yields and device reliability. To date, there has been no accurate method to measure the fracture resistance of such films, which makes it difficult to design improved dielectrics.

NIST researchers believe they have found an answer to the measurement problem in a new adaptation of a materials test technique called nanoindentation. Nanoindentation works by pressing a sharp, hard objecta diamond tipand observing how much pressure it takes to deform the material. For roughly 20 years, researchers have known how to measure elasticity and plasticitythe forces needed to bend a material either temporarily or permanentlyof materials at very small scales with nanoindenters. But toughness, the force needed to actually break the material, has been, well, tougher. Thin films were particularly problematic because they necessarily must be layered on top of another stronger material, such as a silicon wafer.

The new NIST technique requires a slight modification of the nanoindentation equipmentthe probe has to have a sharper, more acute point than normally usedand a hefty dose of theory. Pressing carefully on the dielectric film generates cracks as small as 300 nanometers, which are measured by electron microscopy. Just how the cracks form depends on a complex interaction involving indentation force, film thickness, film stress and the elastic properties of the film and the silicon substrate. These variables are plugged into a new fracture mechanics model that predicts not only the fracture toughness but also another key value, the critical film thickness for spontaneous fracture.

Using this methodology, device manufacturers will be able to eliminate some candidate interconnect dielectric films from consideration without further expensive device testing. The measurement technique and model were published in a two-part series in the Journal of Materials Research.*


Contact: Michael Baum
National Institute of Standards and Technology (NIST)

Related biology technology :

1. Fast molecular rearrangements hold key to plastics toughness
2. Fast molecular rearrangements hold key to plastic’s toughness
3. In Pain Market, Huge Unmet Needs, Tough Regulatory Environment Challenge Pharmaceutical Companies, According to MedPredict
4. Biotech Avoids Fall Out From Tough Quarter for Capital Markets
5. Bringing a New Rhythm to Cardiology Workflow: Siemens Demonstrates Answers to Cardiologys Toughest Questions
6. pH Balanced RepHresh Vaginal Gel(R) now Available to Women in Canada Attacking Tough, Embarrassing Feminine Issues
7. Biotech Drops Amid Tough Markets in February
8. Stretching silicon: A new method to measure how strain affects semiconductors
9. New nanocluster to boost thin films for semiconductors
10. Carbon molecule with a charge could be tomorrows semiconductor
11. Bottoms up: Better organic semiconductors for printable electronics
Post Your Comments:
Related Image:
Cracking a tough nut for the semiconductor industry
(Date:6/23/2016)... ... June 23, 2016 , ... STACS DNA Inc., the sample tracking software ... State Crime Laboratory, has joined STACS DNA as a Field Application Specialist. , ... Tremblay, President and COO of STACS DNA. “In further expanding our capacity as a ...
(Date:6/23/2016)... 2016 Apellis Pharmaceuticals, Inc. today announced ... of its complement C3 inhibitor, APL-2. The trials ... dose studies designed to assess the safety, tolerability, ... in healthy adult volunteers. Forty subjects ... single dose (ranging from 45 to 1,440mg) or ...
(Date:6/23/2016)... -- Andrew D Zelenetz , ... Published recently in Oncology & ... Andrew D Zelenetz , discusses the fact ... placing an increasing burden on healthcare systems worldwide, ... the patents on many biologics expiring, interest in ...
(Date:6/23/2016)... ... 23, 2016 , ... ClinCapture, the only free validated electronic ... showcase its product’s latest features from June 26 to June 30, 2016 for ... Disrupting Clinical Trials in The Cloud during the conference. DIA (Drug Information ...
Breaking Biology Technology:
(Date:6/1/2016)... , June 1, 2016 Favorable ... Election Administration and Criminal Identification to Boost Global Biometrics ... recently released TechSci Research report, " Global Biometrics Market ... Competition Forecast and Opportunities, 2011 - 2021", the global ... by 2021, on account of growing security concerns across ...
(Date:5/20/2016)... -- VoiceIt is excited to announce its new marketing ... working together, VoiceIt and VoicePass will offer an ... slightly different approaches to voice biometrics, collaboration between ... Both companies ... "This marketing and technology partnership allows VoiceIt ...
(Date:5/12/2016)... 12, 2016 , a brand ... overview results from the Q1 wave of its quarterly ... was consumers, receptivity to a program where they would ... health insurance company. "We were surprised to ... Michael LaColla , CEO of Troubadour Research, "primarily ...
Breaking Biology News(10 mins):