Synopsis This conference follows from the success of the previous conferences of the series held in 2002, 2005 and 2008. These tri-annual Electrophoretic Deposition (EPD) conferences are a leading venue for experts from academia and industry working on EPD and its application as a processing technique for fabrication of both traditional and new (nano)materials.
Electrophoretic deposition exploits an electric surface charge on particles in suspension, which migrate in the presence of an appropriate electric field enabling the consolidation of particles into films onto any shaped substrate or forming bulk components. For its successful application, a basic understanding of the colloidal stability, the deposition kinetics, and the constrained drying and sintering issues of the deposit is necessary. Earlier applications of EPD have been in the shaping of ceramic articles and in coating technology. New areas of applications of EPD are the low-cost fabrication of composite and nanostructured materials, including metal-ceramic and polymer nanocomposites, nanocrystalline multilayer structures, composite laminates, biomaterials and functional gradient materials. Furthermore, EPD of electroceramic particulate materials gives potential advances in a number of applications, including piezoelectric motors, biomedical ultrasound probes, chemical sensors as well as multifunctional and bioactive coatings. Moreover EPD is being considered as an important tool in the area of nanotechnology as it enables the production of components of industrial shapes and dimensions from nanoscale elements such as nanoparticles, nanotubes or nanorods. There is also increasing interest in the use of EPD to manipulate biomolecules and biological entities, including natural polymers, proteins, bacteria and cells.
This 2011 meeting will continue the conference tradition of high quality contributions of relevance to both industrial and academic participants, with topics ranging from the fundamental science of EPD to the engineering and applications of the technique in materials processing.
The program will consist of invited and solicited oral and poster presentations.
Sessions topics will include but will not be restricted to:
It is a pleasure to announce that the proceedings of the conference will be published in the Journal Key Engineering Materials (Trans Tech Publishers - http://www.ttp.net/). All submitted papers will be peer-reviewed. Instructions for paper submission will be posted on the conference web site in due time. In addition publication of selected papers in a special Journal issue is planned after the conference.
Prof. A. R. Boccaccini (Chair)
Department of Materials Science and Engineering, University of Erlangen-Nuremberg, Germany
Prof. O. van der Biest (Co-chair)
Department of Metallurgy and Materials Engineering, Katholieke Universiteit Leuven, Belgium
Prof. R. Clasen (Co-chair)
Powder Technology for Glass and Ceramics, University of Saarland, Germany
Prof. J. Dickerson (Co-chair)
Department of Physics and Astronomy, Vanderbilt University, USA
Members of the organizing committee include:
C. Bellmann, (Institute for Polymer Research, Dresden, Germany), A. R. Boccaccini (University of Erlangen-Nuremberg, Germany), R. Clasen (University of Saarland, Germany), K. Moritz (University of Freiberg, Germany), C. Argirusis, (University of Clausthal, Germany), C. Kaya (Yildiz University, Turkey), C. Randall (Penn State University, USA), J. B. Talbot (University of California, San Diego, USA), K. K. Chawla, University of Alabama at Birmingham, USA), C. R. Buie (MIT, USA), E. A. Olevsky (San Diego State University, USA), R. Moreno (Inst. de Ceramica y Vidrio, Spain), B. Ferraris (Inst. de Ceramic y Vidrio, Spain), E. Garcia, (CIDETEC, Spain), P. Sarkar (Alberta Research Council, Canada), I. Zhitomirsky (McMaster University, Canada), A. Matsuda (Toyohashi University of Technology, Japan), H. Negishi (National Institute of Advanced Industrial Science and Technology, Japan), J. Ma (Nanyang Technological University, Singapore), S. Novak (Jozef Stefan Institute, Slovenia), P. Xiao (University of Manchester, UK), J. Riley (Imperial College London, UK), M.P. Ryan (Imperial College London, UK), J. Dickerson, Vanderbilt University, USA), J. Blackburn (IONOTEC, UK), M. J. Santillan (UNC-FCAI, Argentina), T. Uchikoshi (NIMS, Japan), K. Kanamura (Tokyo Metropolitan University, Japan), S. Hayashi (Akita University, Japan), Y. Shimizu (Kyusyu Institute of Technology, Japan), Y. Castro (Inst de Ceramica y Vidrio, Spain), D. Oliver, U. Manitoba, Canada), D. Kuscer (Jozef Stefan Institute, Slovenia), J. Vleugels (KU Leuven, Belgium), O. Van der Biest (KU Leuven, Belgium), R. Cloots (University of Liege, Belgium), C. Leonelli (University of Modena, Italy), C. Galassi (ISTEC, Faenza, Italy), F. De Riccardis (ENEA Brindisi, Italy), G. Vargas Gutierrez (CINVESTAV, Mexico), N. van Leth (Philips, Netherlands), F. Verhoeckx (Philips, Netherlands), P. Vilarinho (University of Aveiro, Portugal), L. Besra (IMMT, India)
Local organizing committee
G. Vargas Gutierrez (CINTESTAV, Saltillo, CIMAV Monterrey, Mexico), L. Godinez (CIDETEQ, Mexico), J. Manriquez (CIDETEQ, Mexico), J. F. Perez Robles (CINVESTAV Queretaro, Mexico), A. M. Arizmendi (CIMAV, Monterrey, Mexico), G. Garcia (CIMAV Monterrey, Mexico)
Submission of Abstracts
Original papers for presentations are invited. If you wish to be considered for an oral or poster presentation, please submit a one-page (300 words) abstract. They should be submitted electronically following the instructions given in On-line Abstract Submission. If unable to submit the abstract electronically, please contact the ECI (firstname.lastname@example.org). All abstracts will be reviewed by the session chairs.
Abstracts for oral presentation: January 15, 2011
Abstracts for poster presentations: March 1, 2011
Graduate students and young investigators are particularly encouraged to present posters. An evening poster session will be an integral part of the conference.
If an abstract has multiple authors who each wish an invitation to attend the conference, each author must submit a separate application.
Conference proceedings It is a pleasure to announce that the proceedings of the conference will be published in the Journal Key Engineering Materials (Trans Tech Publishers - http://www.ttp.net/). All submitted papers will be peer-reviewed. Instructions for paper submission will be posted on the conference web site in due time. In addition publication of selected papers in a special Journal issue is planned after the conference.
|Contact: Kevin Korpics|
Engineering Conferences International