DSA continued to be a subject of high interest, Dusa said: “What caught my attention was the modeling developments combined with applicability on real circuits: a major milestone for future potential adoption.”
Levinson and Dusa also noted the event’s high level of topical synergy evidenced by multiple joint sessions on topics such as lithographic solutions for chip-design layout, and its characteristic large conference-room audiences, particularly in the 2-year-old Etch conference and the 27-year-old Metrology and Process Control conference.
“Developers and executives in the chip-making industry tell us that SPIE Advanced Lithography continues to be the must-attend meeting,” said Peter Hallett, SPIE Director of Marketing and Industry Relations. “This is where significant technology achievements are announced, where R&D challenges are discussed up and down the supply-chain, and where lithographic tools and techniques are introduced.”
A well-trafficked two-day exhibition connected attendees with semiconductor suppliers, integrators, and optical device manufacturers, and a set of professional development courses on EUV lithography, DSA, optical lithography, FEOL/MOL/BEOL lithography, and related technologies began the week.
Day-by-day reports from the conference including full audio and slides from plenary talks are online at http://www.spie.org/ALnews.
Accepted conference proceedings papers will be published in the SPIE Digital Library as soon as approved after the meeting, and in print volumes and digital collections.
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