NEW YORK, Jan. 8 /PRNewswire-FirstCall/ -- e-Smart(R) Technologies, Inc., (Pink Sheets: ESMT); and its parent IVI Smart Technologies, Inc., ("e-Smart(R)" or the "Company") are pleased to announce that in December 2007, the Company completed manufacture and testing of its next generation superthin polyimide flexible circuit biometric card. The name of the new card is "i am."(TM)
The Company has now established the production infrastructure for its next generation of Super Smart Card(TM) cards in Korea. The new "i am"(TM) Super Smart Cards are made with a super adhesion technology and a superthin polyimide flexible circuit that is produced by a continuous in-line manufacturing process. The new "i am"(TM) cards have a super strong adhesive substrate that secures its external surface to its internal circuitry which is anchored into a plastic substrate body in the plastic material of the card's main body. The embedded MPU instantly verifies the identity of the cardholder by comparing the cardholder's fingerprint to the registered and encrypted fingerprint template stored in the card and the processor simultaneously communicates with ISO's standardized card readers and other devices. The new superthin polyimide flexible circuit with super adhesion technology and infrastructure enables our new "i am"(TM) cards to be produced at lower costs, while providing higher security and what experts believe to be a tamper proof card body and counterfeit proof smart card.
The new Super Smart Card will be marketed under the Company's "i am"(TM) trademark. Photographs of the "i am"(TM) card can be found on e-Smart's website at http://www.e-smart.com.
In October of 2007, the Company was awarded U.S. Patent No. 7,278,025
covering aspects of the "i am"(TM) card and has other patent applications
pending. The Company has established its manufacturing and production
process capability in Korea, considered the leadi
|SOURCE e-Smart Technologies, Inc.|
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