One of the biggest obstacles faced today is the physical limitation of metallic electrical interconnects in electronic systems, which are limited both by density and by energy dissipation. One of the proposed solutions is a merger of electronics and photonics into an integrated dual-functional platform -- the optoelectronic integrated circuit (OEIC) fabricated using the existing silicon infrastructure. Session A5 looks at some of the trailblazing technological solutions that use silicon photonic interconnects, which are clearing the way for the steady march of speedy gadgets.
SPEAKERS: David A. B. Miller (Stanford University) will describe the physical requirements and opportunities for dense optical interconnects to chips. Lars Thylen (Swedish Royal Institute of Technology, currently visiting Hewlett-Packard Labs) will discuss the possibilities of pursuing the "Moore's law" like development for photonic devices we have seen over the past few decades. Ashok V. Krishnamoorthy (Oracle) will present a design of a microsystem that uses silicon photonic interconnects to enable a highly compact supercomputer-scale system.
Tuesday press conferences
Tuesday, March 16th, 11:00 a.m.
THE PHYSICS OF HOVERING FLIGHT, COUGHS, AND
|Contact: Jason Bardi|
American Institute of Physics